Apparatus and method for cooling polyimide baking oven

专利摘要:
The present invention relates to a wafer chiller. More specifically, the present invention relates to an apparatus for efficiently and automatically cooling the temperature of a wafer whose temperature rises after the polyimide curing process to a temperature required for the next process. The apparatus for cooling a polyimide curing oven according to the present invention is a device for cooling a temperature of a quartz boat in a polyimide curing oven, which is installed inside an exhaust pipe and an exhaust pipe for discharging the outside air of a quartz boat to open and close the exhaust pipe by an electrical signal. It consists of a solenoid valve, a solenoid valve controller that measures temperature and turns the solenoid valve on and off as an electrical signal according to this temperature, and a connecting line connecting the electrical signal of the solenoid valve controller to the solenoid valve. The polyimide curing oven cooling method according to the present invention is a method of cooling the temperature of a quartz boat in a curing oven by using the polyimide curing oven cooling apparatus. During the polyimide curing process, the solenoid valve controller outputs an off signal to close the exhaust pipe. Closing the solenoid valve, after curing of polyimide, the solenoid valve controller outputs on signal to open the solenoid valve to lower the temperature in the quartz boat, and when the temperature in the quartz boat reaches the set value, the solenoid valve controller outputs an off signal again. The solenoid valve is closed.
公开号:KR20000021410A
申请号:KR1019980040496
申请日:1998-09-29
公开日:2000-04-25
发明作者:서용원；김현태
申请人:윤종용；삼성전자 주식회사；
IPC主号:

专利说明:

Apparatus and method for cooling polyimide baking oven
The present invention relates to a wafer chiller. More specifically, the present invention relates to an apparatus for efficiently and automatically cooling the temperature of a wafer whose temperature rises after the polyimide curing process to a temperature required for the next process.
The semiconductor manufacturing process proceeds in a continuous flow. Various processes of depositing and doping various films on the wafer are sequentially performed, and there is a process of coating polyimide, which is an insulating layer film, on the wafer surface. After coating the polyimide, it must be baked to ensure firm adhesion to the wafer surface. Referring to FIG. 1, this is done in a polyimide curing oven 1 where the wafer is placed in a quartz boat 3 in the oven 1 and the polyimide film is cured at a high temperature of about 350 ° C. After curing the polyimide at such a high temperature, the wafer temperature must be lowered to the temperature required for the next process.
However, in the related art, since there was no separate device for cooling the temperature of the wafer, it was necessary to wait for the wafer to be naturally cooled in the quartz boat 3, thereby increasing the waiting time and reducing the productivity.
Therefore, an object of the present invention is to equip the wafer in the polyimide curing oven with an exhaust pipe for discharging the air inside the quartz boat containing the wafer to the outside, and equipped with a controller for opening and closing the exhaust pipe to efficiently adjust the temperature of the wafer. It is to provide a cooling device and a cooling method for lowering.
1 is a conceptual diagram showing a quartz boat put into a polyimide curing oven.
Figure 2 is a block diagram showing a polyimide curing oven cooling apparatus according to the present invention.
<Description of Major Symbols in Drawing>
1: polyimide curing oven
3: quartz boat
5: exhaust pipe
7: solenoid valve
9: solenoid valve controller
11: connecting line
The apparatus for cooling a polyimide curing oven according to the present invention is a device for cooling a temperature of a quartz boat in a polyimide curing oven, which is installed inside an exhaust pipe and an exhaust pipe for discharging the outside air of a quartz boat to open and close the exhaust pipe by an electrical signal. It consists of a solenoid valve, a solenoid valve controller that measures temperature and turns the solenoid valve on and off as an electrical signal according to this temperature, and a connecting line connecting the electrical signal of the solenoid valve controller to the solenoid valve.
The polyimide curing oven cooling method according to the present invention is a method of cooling the temperature of a quartz boat in a curing oven by using the polyimide curing oven cooling device. Closing the solenoid valve, after the polyimide has finished curing, the solenoid valve controller outputs an on-signal to open the solenoid valve to lower the temperature in the quartz boat. The solenoid valve is closed.
The embodiment will be described with reference to FIG. The polyimide curing oven cooling apparatus according to the present invention is installed in the exhaust pipe 5 for discharging the internal air of the quartz boat 3 to the outside, the solenoid valve 7 to open and close the exhaust pipe by an electrical signal , The solenoid valve controller 9 for measuring the temperature and turning the solenoid valve 7 on and off as an electrical signal according to the temperature, and the connecting line 11 connecting the electrical signal of the solenoid valve controller 9 to the solenoid valve 7. It consists of.
The solenoid valve 7 may be a general one that is turned on or off in response to an electrical signal, for example, a solenoid valve. This is a matter that one skilled in the art can easily think of.
The operation of the polyimide curing oven cooling apparatus configured as described above will be described together with the cooling method.
First, the exhaust pipe 5 should be closed because the temperature in the quartz boat 3 should not drop during the polyimide curing process. At this time, the solenoid valve controller 9 outputs an off signal to close the solenoid valve 7.
When the polyimide curing is completed, the temperature in the quartz boat 3 needs to be lowered, so that the solenoid valve controller 9 outputs an ON signal to open the solenoid valve 7. Now, the hot air in the quartz boat 3 is exchanged with the outside air so that the temperature of the quartz boat 3 drops sharply. Installing an exhaust fan at the end of the exhaust pipe 5 will provide a much faster cooling effect.
When the temperature in the quartz boat 3 reaches the set temperature required in the next step while cooling, the solenoid valve controller 9 again outputs an off signal to close the solenoid valve 7 because the temperature must not be cooled any more.
It will be readily apparent to one skilled in the art that the solenoid valve controller 9 outputs an on-off signal as needed from above. For example, it receives a signal from the oven that the wafer is in the polyimide curing process and processes it to output a solenoid valve off signal. It can be designed to output a signal, measure the temperature drop below the set value with a temperature sensor, and output the solenoid valve off signal when it is below a certain value.
As described above, according to the present invention, the semiconductor device can be cooled quickly and efficiently by solving the conventional productivity decrease during the next process while waiting for the temperature of the polyimide-cured wafer to drop naturally. The productivity of manufacture can be improved.

权利要求:
Claims (2)
[1" claim-type="Currently amended] A device for cooling the temperature of a quartz boat in a polyimide curing oven,
Exhaust pipe for exhausting internal air of quartz boat
Solenoid valve installed inside the exhaust pipe to open and close the exhaust pipe by electric signal,
Solenoid valve controller for measuring the temperature and turning the solenoid valve on and off as an electrical signal according to the temperature
Polyimide curing oven cooling apparatus including a connecting line for connecting the electrical signal of the solenoid valve controller to the solenoid valve.
[2" claim-type="Currently amended] A method of cooling a wafer temperature in an oven by using the polyimide curing oven cooling apparatus of claim 1,
During the polyimide curing process, the solenoid valve controller outputs an off signal to close the exhaust pipe to close the exhaust pipe,
After curing the polyimide, the solenoid valve controller outputs an ON signal to open the solenoid valve to lower the temperature in the quartz boat.
And closing the solenoid valve by outputting an off signal to the solenoid valve controller again when the temperature in the quartz boat reaches a set value.

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同族专利:

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引用文献:

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公开号 | 申请日 | 公开日 | 申请人 | 专利标题

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法律状态:
1998-09-29|Application filed by 윤종용, 삼성전자 주식회사

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1998-09-29|Priority to KR1019980040496A

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2000-04-25|Publication of KR20000021410A

优先权:

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申请号 | 申请日 | 专利标题

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KR1019980040496A|KR20000021410A|1998-09-29|1998-09-29|Apparatus and method for cooling polyimide baking oven|